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  power mosfets 1 publication date: march 2004 sjg00036aed 2SK3723 n-channel enhancement mode mosfet features ? low on-resistance, low q g ? high avalanche resistance applications ? for pdp ? for high-speed switching absolute maximum ratings t c = 25 c electrical characteristics t c = 25 c 3 c unit: mm parameter symbol rating unit drain-source surrender voltage v dss 150 v gate-source surrender voltage v gss 30 v drain current i d 30 a peak drain current i dp 120 a power dissipation p d 50 w t a = 25 c3 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c 0 to 0.5 123 (8.9) (10.2) 0 to 0.3 (2.1) (6.4) (1.4) 10.5 0.3 4.6 0.2 1.4 0.1 0.8 0.1 2.5 0.2 1.4 0.1 2.54 0.3 10.1 0.3 3.0 0.5 (1.4) 1.5 0.3 0.6 0.1 1: gate 2: drain 3: source to-220c-g1 package internal connection marking symbol: k3723 g d s parameter symbol conditions min typ max unit drain-source surrender voltage v dss i d = 1 ma, v gs = 0 150 v gate threshold voltage v th v ds = 25 v, i d = 1 ma 2 4 v drain-source cutoff current i dss v ds = 120 v, v gs = 0 100 a gate-source cutoff current i gss v gs = 30 v, v ds = 0 1 a drain-source on resistance r ds(on) v gs = 10 v, i d = 15 a 33 42 m ? forward transfer admittance ? y fs ? v ds = 25 v, i d = 15 a 8 18 s short-circuit forward transfer capacitance c iss v ds = 25 v, v gs = 0, f = 1 mhz 2 900 pf (common-source) short-circuit output capacitance c oss 618 pf (common-source) reverse transfer capacitance c rss 91 pf (common-source) turn-on delay time t d(on) v dd 100 v, i d = 15 a 32 ns rise time t r r l = 6.7 ? , v gs = 10 v 46 ns turn-off delay time t d(off) 227 ns fall time t f 66 ns
2SK3723 2 sjg00036aed safe operation area p c ? t a drain current i d ( a ) drain-source voltage v ds ( v ) 10 ? 1 10 1 100 1 000 1 10 100 1 000 i dp i d t = 100 s t = 1 ms t = 10 ms non repetitive pulse t c = 25 c 100 50 0 050 25 100 75 125 150 ambient temperature t a ( c ) collector power dissipation p c ( w ) (1) (2) (1) t c = t a (2) without heat sink parameter symbol conditions min typ max unit diode foward voltage v dsf i dr = 30 a, v gs = 0 ? 1.5 v reverse recovery time t rr l = 230 h, v dd = 100 v 130 ns reverse recovery charge q rr i dr = 15 a, di/dt = 100 a/ s 533 nc gate charge load q g v dd = 100 v, i d = 15 a 55.4 nc gate-source charge q gs v gs = 10 v 9.1 nc gate-drain charge q gd 22.4 nc thermal resistance (ch-c) r th(ch-c) 2.5 c/w thermal resistance (ch-a) r th(ch-a) 89.2 c/w electrical characteristics (continued) t c = 25 c 3 c note) measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors.
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep


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